Please use this identifier to cite or link to this item: https://dspace.upt.ro/xmlui/handle/123456789/1711
Title: Di-2-ethylhexyl phosphoric acid immobilization with polysulfone microcapsules for Cu(II) extraction [articol]
Authors: Ciopec, Elvira-Mihaela
Davidescu, Corneliu Mircea
Negrea, Adina
Lupa, Lavinia Afrodita
Negrea, Petru
Popa, A.
Subjects: Chimie fizică
Cinetică chimică
Articol
Chimie anorganică
Articol
Polysulfone microcapsules
Removal
Di-(2-ethylhexyl) phosphoric acid
Copper
Issue Date: 2011
Publisher: Timişoara: Editura Politehnica
Citation: Ciopec, Mihaela. Di-2-ethylhexyl phosphoric acid immobilization with polysulfone microcapsules for Cu(II) extraction . Timişoara: Editura Politehnica, 2011
Series/Report no.: Buletinul ştiinţific al Universităţii „Politehnica” din Timişoara, România. Seria chimie şi ingineria mediului, Tom 56(70), fasc. 1 (2011), p. 43-46
Abstract: This paper reports the results of the adsorption performance of Cu(II) removal from aqueous solutions by an impregnated resin, polysulfone microcapsules (PS) containing di-2-ethylhexyl phosphoric acid (D2EHPA). The adsorbent was obtained by solvent impregnated resin (SIR) method. The adsorption performance of the studied material was evaluated studying the effects of two physico-chemical parameters: contact time and Cu(II) initial concentration. The adsorption experiments were carried out following batch equilibrium techniques. The kinetic parameters of different models were calculated and discussed. The equilibrium adsorption data were modeled using Freundlich and Langmuir isotherm equations and the corresponding isotherm parameters were calculated and discussed in detail. The material showed good adsorption performance in the removal process of Cu(II) ions from aqueous solution.
URI: http://primo.upt.ro:1701/primo-explore/search?query=any,contains,Di-2-ethylhexyl%20phosphoric%20acid%20immobilization%20with%20polysulfone%20microcapsules%20for%20Cu(II)%20extraction&tab=default_tab&search_scope=40TUT&vid=40TUT_V1&lang=ro_RO&offset=0 Link Primo
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