Effect of aromatic amines on the diffusion layer thickness during the copper electrodeposition from acid bath [articol]

Abstract

In this paper we have shown that some aromatic amines like aniline, benzylamine, N-methylaniline, N-ethylaniline, N,N-dimethylaniline, N,N-diethylaniline, o-toluidine, m-toluidine and p-toluidine added in the electrolyte solution influence the copper electrodeposition process by decreasing the diffusion layer thickness. Experimental results have been obtained by linear sweep voltammetry and chronoamperometry. The qualitative results obtained by linear voltammetry show a significant effect of aromatic amines on the cathodic copper electrodeposition. The semi-quantitative results obtained by chronoamperometry have been used to determine the diffusion coefficient of Cu²⁺ ions using the Randles – Sevcik equation. The calculated values of the diffusion layer thickness decrease from 40 µm in the blank electrolyte solution to 13 µm in the presence of 1 mL L⁻¹ m-toluidine.