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Title: Effect of aromatic amines on the diffusion layer thickness during the copper electrodeposition from acid bath [articol]
Authors: Văduva, Constantin Claudiu
Vaszilcsin, Nicolae
Kellenberger, Andrea
Subjects: Electrochimie
Copper electrodeposition
Diffusion coefficient
Diffusion layer thickness
Issue Date: 2011
Publisher: Timişoara: Editura Politehnica
Citation: Văduva, Constantin Claudiu. Effect of aromatic amines on the diffusion layer thickness during the copper electrodeposition from acid bath. Timişoara: Editura Politehnica, 2011
Series/Report no.: Buletinul ştiinţific al Universităţii „Politehnica” din Timişoara, România. Seria chimie şi ingineria mediului, Tom 56(70), fasc. 2 (2011), p. 75-80
Abstract: In this paper we have shown that some aromatic amines like aniline, benzylamine, N-methylaniline, N-ethylaniline, N,N-dimethylaniline, N,N-diethylaniline, o-toluidine, m-toluidine and p-toluidine added in the electrolyte solution influence the copper electrodeposition process by decreasing the diffusion layer thickness. Experimental results have been obtained by linear sweep voltammetry and chronoamperometry. The qualitative results obtained by linear voltammetry show a significant effect of aromatic amines on the cathodic copper electrodeposition. The semi-quantitative results obtained by chronoamperometry have been used to determine the diffusion coefficient of Cu²⁺ ions using the Randles – Sevcik equation. The calculated values of the diffusion layer thickness decrease from 40 µm in the blank electrolyte solution to 13 µm in the presence of 1 mL L⁻¹ m-toluidine.
URI:,contains,Effect%20of%20aromatic%20amines%20on%20the%20diffusion%20layer%20thickness%20during%20the%20copper%20electrodeposition%20from%20acid%20bath&tab=default_tab&search_scope=40TUT&vid=40TUT_V1&lang=ro_RO&offset=0 Link Primo
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