Research on solder joint lifetime of surface-mounted devices

Abstract

This research focuses on improving solder joint reliability in electronics, specifically in the automotive industry, through applied methods such as virtual prototyping, simulation-based reliability assessment, and the development of practical guidelines. The study employs a combination of experimental and theoretical approaches, including board-level reliability tests, analytical calculations, and finite element analysis. The research contributes enhancing reliability in electronic devices through the implementation of a PCBA low-cycle fatigue assessment workflow.