Abstract:
This paper reports the results of the adsorption performance of Cu(II) removal from aqueous solutions by an impregnated resin, polysulfone microcapsules (PS) containing di-2-ethylhexyl phosphoric acid (D2EHPA). The adsorbent was obtained by solvent impregnated resin (SIR) method. The adsorption performance of the studied material was evaluated studying the effects of two physico-chemical parameters: contact time and Cu(II) initial concentration. The adsorption experiments were carried out following batch equilibrium techniques. The kinetic parameters of different models were calculated and discussed. The equilibrium adsorption data were modeled using Freundlich and Langmuir isotherm equations and the corresponding isotherm parameters were calculated and discussed in detail. The material showed good adsorption performance in the removal process of Cu(II) ions from aqueous solution.
